Application
HSL-6002 is professionally designed for the determination of heat sealability of various kinds
cup cover films of yogurt cups, instant noodles, capsule coffee cups, jelly cups etc. Heat
sealability of film depends on heat seal temperature, heat seal pressure and heat dwell time.
Features
1: Professional for cup cover film heat sealing test
2: Embedded system control, patent technology
3: Touch screen operation, easy to operate
4: TFT LCD display, UI flattening design
5: Flexible cup support frame, customized available
6: Micro-printer prints mini-report
7: Pressure easy to adjust, heat temperature and time touch screen input.
8: Emergency stop button, safety design to prevent burns
9: Over temperature protection, over pressure protection
10: Silence working without cooling fans
11: DB9 RS232 communication port.
12: DSM system is optional(Laboratory Management Information System), easy to manage
and share test data.
Technical Indexes
Heat temperature: Room temperature+6 – 300℃
Accuracy: ±0.2 ℃
Dell time: 0.1- 999.9s
Pressure: 0.05 MPa-1.0MPa
Max cover film area: 265mm × 90 mm
Cup frame: 280mm × 145 mm × 105 mm (customized available)
Cup model: 66mm, 63mm, 58 mm (customized available)
Gas source pressure: 0.05MPa – 1.0MPa (self-provide)
Gas source interface: Ф6mm
Outer dimension: 570 mm (L)×500 mm (W)×470 mm (H)
Work noise: 0db
Power supply: AC 220V 50Hz
Net weight: 63kg
Standards
QB/T 2358(ZBY 28004), ASTM F2029, YBB 00122003
Configuration
Standard configuration: main unit, micro-printer, footswitch.
Optional: Customized cup frame, Film clip, Communication cable, DSM system
